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CARIS (Pattern AOI)

CARIS-5000DC

Overview

Automated detection of defects on printed circuit board patterns using optical devices and dedicated image processing software

Features
  • Customizable inspection area implementation
  • Rapid CAM reference generation enables job setup of diverse product types
  • High-speed inspection capability powered by advanced high-speed cameras and high-performance software
  • Multiple high-speed and large-format cameras for inline inspection capability
  • Unmanned automation equipment minimizing downtime and maximizing efficiency
Specifications
CAM Interface
ODB++, GDS-II, RS-274D/X (Gerber), DPF, Fire-9xxx, DNS RP/RPH
Maximum product size
610 x 810 mm
Minimum L/S
40 µm
Resolution
8 µm
Weight
About 7,000 kg
Dimension
7900 (W) x 4000 (D) x 2200 (H) mm

CARIS-1100M

Overview

Automated measurement and inspection of defects, pattern width, and copper thickness on PCB patterns using optical devices and dedicated image processing software

Features
  • Customizable inspection area implementation
  • Rapid CAM reference generation enables job setup of diverse product types
  • High-speed inspection capability powered by advanced high-speed cameras and high-performance software
  • Simultaneous 2D AOI + 3D circuit width and thickness measurement
  • 2D high-speed color camera integration
  • 3D inspection function using WLI
Specifications
CAM Interface
ODB++, GDS-II, RS-274D/X (Gerber), DPF, Fire-9xxx, DNS RP/RPH
Maximum product size
610 x 810 mm
Minimum L/S
40 µm
Resolution (2D)
2.5 ~ 8 µm (Preset)
Resolution (3D)
Z 0.02 µm , X 1.2 µm
Weight
About 3,500 kg
Dimension
1780 (W) x 2700 (D) x 2000 (H) mm

CARIS-1000

Overview

Automated inspection of defects on FC-BGA, Advanced Fine line PBGA, CSP, and FPC patterns using optical devices and dedicated image processing software

Features
  • Customizable inspection area implementation
  • Rapid CAM reference generation enables job setup of diverse product types
  • High-speed inspection capability powered by advanced high-speed cameras and high-performance software
  • Variable inspection resolution
  • Solution for complex PCB inspection requirements
Specifications
CAM Interface
ODB++, GDS-II, RS-274D/X (Gerber), DPF, Fire-9xxx, DNS RP/RPH
Maximum product size
610 x 610 mm
Minimum L/S
8 / 8 µm
Resolution
2 ~ 2.5 µm (Variable)
Weight
About 2,500 kg
Dimension
1300 (W) x 2300 (D) x 2100 (H) mm
CARIS-1000
CARIS-1100H
Overview

Measurement of PCB back drill hole blockage and deviation using optical devices and dedicated image processing software

Features
  • Customizable inspection area implementation
  • Rapid CAM reference generation enables job setup of diverse product types
  • High-speed inspection capability powered by advanced high-speed cameras and high-performance software
  • Telescope lens integration
  • Automatic measurement and defect determination using PCB back drill data
Specifications
CAM Interface
ODB++, GDS-II, RS-274D/X (Gerber), DPF, Fire-9xxx, DNS RP/RPH
Maximum product size
610 x 760 mm
Resolution
12 µm
Minimum hole size
200 µm ~
Weight
About 4,500 kg
Dimension
4380 (W) x 3000 (D) x 2250 (H) mm

CARIS-1000MCT

Overview

Measurement of hole plugging depth and Cu thickness using optical devices and dedicated image processing software

Features
  • Customizable inspection area implementation
  • Rapid CAM reference generation enables job setup of diverse product types
  • High-speed inspection capability powered by advanced high-speed cameras and high-performance software
  • High-speed and large-format 3D scanner for rapid wide-area inspection
  • Automated 3D shape measurement and defect determination at CAM data-specified locations
Specifications
CAM Interface
ODB++, GDS-II, RS-274D/X (Gerber), DPF, Fire-9xxx, DNS RP/RPH
Maximum product size
610 x 810 mm
Minimum hole size
70 µm ~
Resolution
Z 0.19 µm , X 6.7 µm
Weight
About 3,800 kg
Dimension
2000 (W) x 2000 (D) x 2200 (H) mm
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